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Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

Li Xu ; Cong Yue ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Yan Zhang ; Xiuzhen Lu ; Zhaonian Cheng
2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008 (2008)
[Konferensbidrag, refereegranskat]

Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.



Denna post skapades 2008-12-22. Senast ändrad 2017-12-06.
CPL Pubid: 82535

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)

Ämnesområden

Elektroteknik och elektronik

Chalmers infrastruktur