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60 GHz broadband 0=1-level RF-via interconnect for RF-MEMS packaging

W.C. Wu ; L. H. Hsu ; E. Y. Chang ; J. Piotr Starski (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap)
Electronics Letters Vol. 43 (2007), 22, Oct. 25,
[Artikel, refereegranskad vetenskaplig]

The RF-via interconnect structure from the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0=1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package

Nyckelord: RF via interconnect

Denna post skapades 2008-01-08. Senast ändrad 2017-03-21.
CPL Pubid: 64708