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60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects

W.-C. Wu ; L.-H. Hsu ; E.Y. Chang ; Camilla Kärnfelt (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap) ; J. Piotr Starski (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Y.-C. Wu
Microwave and Wireless Components Letters, IEEE Vol. 17 (2007), 11, Nov. 2007, p. 784-786.
[Artikel, refereegranskad vetenskaplig]

In this letter, the microstrip-to-coplanar waveguide (MS-to-CPW) hot-via flip chip interconnect has been experimentally demonstrated to have broadband performance from dc to 67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67 GHz. The optimized interconnect structure with the compensation design demonstrated excellent RF characteristics with the insertion loss less than 0.5 dB and the return loss below 18 dB over a very broad bandwidth from dc to 67 GHz. This is to our

Nyckelord: MS-to-CPW Hot-Via Flip Chip Interconnects


Coplanar waveguide (CPW), finite ground coplanar (FGC) waveguide, flip chip, hot-via, interconnect, microstrip (MS).



Denna post skapades 2008-01-08. Senast ändrad 2015-08-10.
CPL Pubid: 64704