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Silicon Taper Based D-Band Chip to Waveguide Interconnect for Millimeter-Wave Systems

Ahmed Hassona (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Vessen Vassilev (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Zhongxia Simon He (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Chiara Mariotti ; Franz Dielacher ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik)
IEEE Microwave and Wireless Components Letters (1531-1309). Vol. 27 (2017), 12,
[Artikel, refereegranskad vetenskaplig]

This letter presents a novel interconnect for coupling millimeter-wave (mmW) signals from integrated circuits to air-filled waveguides. The proposed solution is realized through a slot antenna implemented in embedded wafer level ball grid array (eWLB) process. The antenna radiates into a high-resistivity (HR) silicon taper perpendicular to its plane, which in turn radiates into an air-filled waveguide. The interconnect achieves a measured average insertion loss of 3.4 dB over the frequency range of 116-151 GHz. The proposed interconnect is generic and does not require any galvanic contacts. The utilized eWLB packaging process is suitable for low-cost high-volume production and allows heterogeneous integration with other technologies. This letter proposes a straightforward cost-effective high-performance interconnect for mmW integration, and thus, addressing one of the main challenges facing systems operating beyond 100 GHz.

Denna post skapades 2017-11-08. Senast ändrad 2018-01-10.
CPL Pubid: 253006


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik



Chalmers infrastruktur