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Heat dissipation performance of graphene enhanced electrically conductive adhesive for electronic packaging

Y. Yang ; H. Ye ; W. Ke ; S. Huang ; Nan Wang (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; X. Lu ; J. Bao ; L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017 p. 125-128. (2017)
[Konferensbidrag, refereegranskat]

Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal conductivity. Thermal conductivity of the electrically conductive adhesive was measured by laser flash thermal analyzer. The infrared thermal imager was utilized to obtain the temperature distribution of chip surface. The results indicated that the developed graphene enhanced electrically conductive adhesive has perfect heat performances. It can be believed that this new kind of electrically conductive adhesive possesses promising application in electronic packaging in the future.

Nyckelord: electrically conductive adhesive, heat dissipation, silver coated graphene



Denna post skapades 2017-09-20.
CPL Pubid: 252008

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system

Ämnesområden

Materialkemi

Chalmers infrastruktur