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Sintering of SiC enhanced copper paste for high power applications

Marti Gutierrez (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Nan Wang (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Majid Kabiri Samani (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017 p. 151-156. (2017)
[Konferensbidrag, refereegranskat]

In this work a Cu paste consisting in both micro and nanoparticles was produced. The copper paste was produced with different additive weight percentages of Ag coated SiC and sintered for 30min at 500°C under 6,5MPa in N2 atmosphere. The thermal resistance and composition of the resulting joints was studied. XPS and EDX measurements show no significant oxidation of the Cu after sintering, which is attributed to the combination of reductive agents in the paste and the inert atmosphere. SEM images of cross sections show contacts with no voids between the SiC particles and the copper matrix. Thermal conductivity measurements with laser flash analysis (LFA) show that the additive increases the effective thermal conductivity to more than double of that of the pure copper paste at 2% additive weight percentage, but bigger amounts yield smaller improvements and presumably would eventually worsen it.

Nyckelord: Copper, heat management, nanoparticle, sintering, thermal characterization, TIM



Denna post skapades 2017-09-19.
CPL Pubid: 251968

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system

Ämnesområden

Keramteknik

Chalmers infrastruktur