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Graphene-based heat spreading materials for electronics packaging applications

G. Yuan ; B. Shan ; S. Chen ; Y. Yang ; J. Bao ; Nan Wang (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Peng Su (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; S. Huang ; Y. Zhang ; L. Ye ; Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017 p. 172-174. (2017)
[Konferensbidrag, refereegranskat]

Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.

Nyckelord: electronics packaging, graphene-based electrically conductive adhesive, graphene-based film, heat spreading materials



Denna post skapades 2017-09-19.
CPL Pubid: 251965

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system

Ämnesområden

Materialkemi

Chalmers infrastruktur