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Investigation of thermal interface materials reinforced with micro- and nanoparticles

K. Janeczek ; A. Arazna ; Y. Zhang ; S. Ma ; J. Sitek ; J. Fan ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; K. Lipiec
China Semiconductor Technology International Conference 2017, CSTIC 2017 (2017)
[Konferensbidrag, refereegranskat]

Heat management is one of the major challenges in modern electronic devices. The higher performance results in a production of greater amount of heat which needs to be efficiently dissipated so as to ensure the electronic devices operational during the period of lifetime. This paper discusses the application of micro- and nano-materials in thermal interface materials (TIM) used for heat management. Effects of type, size and geometry of different fillers were experimentally investigated. The results showed that it is recommended to utilize silver particles compared to copper ones to achieve higher heat dissipation. And the particles of smaller size may enhance the thermal conductivity of elaborated materials.

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Denna post skapades 2017-07-03. Senast ändrad 2017-08-11.
CPL Pubid: 250320


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system



Chalmers infrastruktur