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Test structures for studying flexible interconnect supported by carbon nanotube scaffolds

Kjell Jeppson (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Di Jiang (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Shuangxi Sun (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Michael Edwards (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
International Conference on Microelectronic Test Structures Vol. 2017 (2017),
[Konferensbidrag, refereegranskat]

Due to their flexibility and compatibility with silicon devices, the use of carbon nanotubes as scaffolds for metal interconnect in flexible and wearable electronics has been proposed. This paper examines the performance of dual-height carbon nanotubes as flexible scaffolds for horizontal and vertical interconnects. For this purpose, a number of test structures have been designed and fabricated and their electrical and mechanical performance been investigated.



Denna post skapades 2017-06-09.
CPL Pubid: 249643