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Application of two-dimensional layered hexagonal boron nitride in chip cooling

J. Bao ; Y. Zhang ; S. Huang ; Shuangxi Sun (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; X. Lu ; Y. Fu ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering (1005-0930). Vol. 24 (2016), 1, p. 210-217.
[Artikel, övrig vetenskaplig]

© 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.

Nyckelord: Boron nitride, Heat dissipation, Single layer, Thermal evaluation chip

Denna post skapades 2017-04-27.
CPL Pubid: 248984


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