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Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs

A. Pooth ; Johan Bergsten (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Niklas Rorsman (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; H. Hirshy ; R. Perks ; P. Tasker ; T. Martin ; R. F. Webster ; D. Cherns ; M. J. Uren ; M. Kuball
Microelectronics and reliability (0026-2714). Vol. 68 (2017), p. 2-4.
[Artikel, refereegranskad vetenskaplig]

The morphology and impact on leakage currents of two different ohmic metal stacks for GaN based transistor devices is investigated in this work. The results have implications for the performance and reliability of a GaN transistor device. A low temperature Ta based and a higher temperature anneal Ti based metallization are compared. The low temperature process shows a smoother metal semiconductor interface together with several orders of magnitude lower vertical and lateral leakage compared to the conventional higher temperature process. In addition to the leakage tests, back bias ramping experiments are performed unveiling potential advantages of the conventional approach in mitigating current collapse. However the low leakage will enable higher voltage operation making the low temperature process the preferable choice for high power RF applications, if simultaneously current collapse can be controlled.

Nyckelord: Current collapse, GaN, Leakage current, Morphology, Ohmic contact, Transistor

Denna post skapades 2017-01-30. Senast ändrad 2017-03-09.
CPL Pubid: 247890


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik


Elektroteknik och elektronik

Chalmers infrastruktur