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Thermal properties of TIM using CNTs forest in electronics packaging

Dongsheng Zhang ; Jiawen Liu ; Shuangxi Sun (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Shirong Huang ; Jie Bao ; Ning Wang ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Xiuzhen Lu
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016 p. 1355-1359. (2016)
[Konferensbidrag, refereegranskat]

Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.

Nyckelord: dissipation, heat, hotspot, resistance temperature detector, thermal test chip, VACNT

Denna post skapades 2016-12-19. Senast ändrad 2017-01-17.
CPL Pubid: 246246


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