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Impact of Bonding Interface Thickness on the Performance of Silicon-Integrated Hybrid-Cavity VCSELs

Emanuel P. Haglund (Institutionen för mikroteknologi och nanovetenskap, Fotonik) ; Sulakshna Kumari ; Erik Haglund (Institutionen för mikroteknologi och nanovetenskap, Fotonik) ; Johan S. Gustavsson (Institutionen för mikroteknologi och nanovetenskap, Fotonik) ; Roel G. Baets ; Gunther Roelkens ; Anders Larsson (Institutionen för mikroteknologi och nanovetenskap, Fotonik)
25th IEEE International Semiconductor Laser Conference (ISLC), 12-15 Sept. 2016 (1947-6981). p. Article no 7765752. (2016)
[Konferensbidrag, refereegranskat]

The dependence of the performance of short-wavelength silicon-integrated hybrid-cavity VCSELs on the thickness of the bonding interface used for the heterogeneous integration has been studied. Performance measures investigated include the emission wavelength, thermal impedance, and variation of threshold current and output power with temperature.

Nyckelord: Heterogeneous integration, semiconductor lasers, silicon photonics, vertical-cavity surface-emitting laser (VCSEL)



Denna post skapades 2016-12-07. Senast ändrad 2017-03-27.
CPL Pubid: 245931