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Dynamic Recrystallization During High-Strain-Rate Tension of Copper

Seyedeh Nooshin Mortazavi (Institutionen för fysik, Materialens mikrostruktur (Chalmers)) ; Nicola Bonora ; Andrew Ruggiero ; Magnus Hörnqvist Colliander (Institutionen för fysik, Materialens mikrostruktur (Chalmers))
Metallurgical and Materials Transactions. A (1073-5623). Vol. 47A (2016), 6, p. 2555-2559.
[Artikel, refereegranskad vetenskaplig]

Discontinuous dynamic recrystallization can occur during dynamic tensile extrusion of copper, which is subjected to uniaxial tensile strains of ~5 and strain rates up to 10^6 s^-1 in the extruded section. Through high-resolution transmission Kikuchi diffraction, we show that nucleation occurs through subgrain rotation and grain boundary bulging at boundaries between <001> and <111> oriented grains. The observed nuclei consist of subgrains with a size of approximately 200 to 400 nm.

Nyckelord: Copper; Dynamic recrystallization; Grain boundaries; Recrystallization (metallurgy); Strain; Tensile strength; Discontinuous dynamic recrystallization; Dynamic tensile extrusions; High resolution; High strain rates; Subgrain rotation; Subgrains; Uniaxial tensile strain

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Denna post skapades 2016-05-26. Senast ändrad 2017-03-02.
CPL Pubid: 236956


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