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Experimental measurements for mechanical and electrical conductive properties of CNT bundles

Y. Zhang ; Y. J. Zhou ; J. Y. Fan ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013 p. 454-457. (2013)
[Konferensbidrag, refereegranskat]

With the miniaturization and multifunction trend in consumer electronics and other numerous applications, the characteristic sizes of chips, components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase constantly. Carbon nanotube (CNT) has become a promising material due to its mechanical and conductive properties. In this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

Nyckelord: Carbon, Consumer electronics, Heat flux, Yarn, Characteristic size, Conductive properties, Electrical conductivity, Flip chip interconnects, Heat flux densities, Mechanical and electrical, Mechanical behavior, Silicon chip, Carbon nanotubes

Denna post skapades 2016-05-12.
CPL Pubid: 236428


Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Bioinformatik och systembiologi

Chalmers infrastruktur