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A four level silicon microstructure fabrication by DRIE

Sofia Rahiminejad (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Piotr Cegielski (Institutionen för mikroteknologi och nanovetenskap) ; Morteza Abbasi (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Peter Enoksson (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
Journal of microelectromechanical systems (1057-7157). Vol. 26 (2016), 8, p. 084003.
[Artikel, refereegranskad vetenskaplig]

We present a four level Si microstructure fabrication process with depths ranging from 70-400 μm. All four levels are etched from the same side, by using four hard masks (SiO2, Al, AZ4562 photo resist, and Al). The choice of the hard masks and their relative selectivity will be discussed. Also two different deep reactive ion etching (DRIE) processes, performed in two different machines, are compared and evaluated. The process evaluation and discussions are based on the vertical walls deviation from a right angle, the surface roughness and the resolution. In the end, a solution is proposed to remove spikes and grassing which appeared during both DRIE processes, and the impact of removing them from the surfaces is discussed.

Nyckelord: DRIE, MEMS, micromachining

Denna post skapades 2016-04-05. Senast ändrad 2017-07-03.
CPL Pubid: 234103


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