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Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Si Chen (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Xin Luo (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; Yifeng Fu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system ) ; L. L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system )
Microelectronics and reliability (0026-2714). Vol. 56 (2016), p. 129-135.
[Artikel, refereegranskad vetenskaplig]

This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.

Nyckelord: Nano-TIM, Nano-fiber, Microelectronic packaging



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Denna post skapades 2016-03-02. Senast ändrad 2016-07-06.
CPL Pubid: 232670

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Elektronikmaterial och system

Ämnesområden

Produktion
Nanoteknik

Chalmers infrastruktur

 


Projekt

Denna publikation är ett resultat av följande projekt:


Smart integration of GaN & SiC high power electronics for industrial and RF applications (SMARTPOWER) (EC/FP7/288801)