CPL - Chalmers Publication Library
| Utbildning | Forskning | Styrkeområden | Om Chalmers | In English In English Ej inloggad.

Integration of a 140 GHz Packaged LTCC Grid Array Antenna with an InP Detector

Bing Zhang (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; H. Gulan ; T. Zwick ; Y. Li ; U. Oderfalt ; F. Carlsson ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik)
IEEE Transactions on Components, Packaging, and Manufacturing Technology (2156-3950). Vol. 5 (2015), 8, p. 1060-1068.
[Artikel, refereegranskad vetenskaplig]

Integration of a 140-GHz packaged low-temperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-in-package. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Parallel plate mode is observed in the InP substrate and absorbed by the LTCC substrate. The comparison between the measured responsivity of the power detector with and without the antenna indicates the acceptable insertion loss of the coplanar GSG bond wires transition. It shows a feasible solution for the D-band front-end integration and packaging.

Nyckelord: Antenna-in-package (AiP), grid array antenna (GAA), low-temperature cofired ceramic (LTCC), parallel plate mode (PPM)

Article number 7173018

Denna post skapades 2015-09-16. Senast ändrad 2017-03-21.
CPL Pubid: 222568


Läs direkt!

Länk till annan sajt (kan kräva inloggning)