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Packaging of MMIC by using gap waveguide and design of a microstrip to ridge gap waveguide transition

Ashraf Uz Zaman (Institutionen för signaler och system, Antenner) ; Per-Simon Kildal (Institutionen för signaler och system, Antenner)
2013 3rd Asia-Pacific Microwave Conference, APMC 2013; Seoul; South Korea; 5 November 2013 through 8 November 2013 p. 10-12. (2013)
[Konferensbidrag, refereegranskat]

In this work, gap waveguide based packaging technique is used to improve the isolation among critical microwave circuit components such as high gain amplifier chain. Amplifier chains at Ka-band were tested for a stable forward gain and it was found that-with gap waveguide packaging, 65∼70dB of forward gain is achievable without the problem of self-resonance. Apart from the new packaging technique, a low-loss transition from microstrip to ridge-gap waveguide had been designed and tested. This transition is a key component to connect such amplifier chains to a planar slot array antenna. Experimental results for manufactured back to back transition show 14 dB return loss over 55% relative bandwidth from 2343GHz.

Nyckelord: Cross-talk , feedback , PEC , PMC , Ridge gap waveguide , self-oscillation , Slot-array antenna

Denna post skapades 2015-05-05. Senast ändrad 2016-07-12.
CPL Pubid: 216446


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Institutioner (Chalmers)

Institutionen för signaler och system, Antenner (2005-2014)



Chalmers infrastruktur