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Experimental results versus numerical simulations of In/Cu intermetallic compounds growth

T. Fałat ; B.T. Płatek ; P.K. Matkowski ; J. Felba ; Carl Zandén (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014 p. 797-800. (2014)
[Konferensbidrag, refereegranskat]

Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.

Article number 7028372

Denna post skapades 2015-03-24. Senast ändrad 2016-07-12.
CPL Pubid: 214245


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Elektroteknik och elektronik

Chalmers infrastruktur