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A highly integrated chipset for 40 Gbps wireless D-band communication based on a 250 nm InP DHBT technology

Sona Carpenter (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Zhongxia He (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; M. Bao ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik)
Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC (1550-8781). (2014)
[Konferensbidrag, refereegranskat]

A highly integrated chipset comprising a transmitter (TX) and a receiver (RX) chip, based on a 250 nm InP DHBT technology for high data rate D-band (110-170 GHz) wireless communication is described. The chipset is designed for point-to-point wireless communication for 4G and 5G mobile communication infrastructure, high data rate backhaul, low-latency wireless HDTV transmission and >40 Gbps transmission over dielectric waveguide. The measured RX conversion gain is 26 dB, with a noise figure of 9 dB. The measured TX conversion gain is 20 dB. A maximum QPSK data rate of 44 Gbps is demonstrated, which exceeds the present state-of-the art in the D-band by a factor of 2.

Nyckelord: BPSK, D-band, InP DHBT, QPSK, RX/TX, Wireless communication



Denna post skapades 2015-01-14. Senast ändrad 2015-08-10.
CPL Pubid: 210680

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik

Ämnesområden

Elektroteknik och elektronik

Chalmers infrastruktur