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A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Carl Zandén (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Xin Luo (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Li-Lei Ye (Institutionen för mikroteknologi och nanovetenskap)
Composites Science And Technology (0266-3538). Vol. 94 (2014), p. 54-61.
[Artikel, refereegranskad vetenskaplig]

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.

Denna post skapades 2014-12-09. Senast ändrad 2014-12-10.
CPL Pubid: 207735


Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)
Institutionen för mikroteknologi och nanovetenskap



Chalmers infrastruktur