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Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application

J. Sitek ; M. Kościelski ; Y. Zhang ; J. Fan ; S. Ma ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014 Art. no. 6922625, p. 151-154. (2014)
[Konferensbidrag, refereegranskat]

The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.

Nyckelord: Electrically conductive adhesives , mechanical properties , nano additives , printed electronics , reliability of interconnects



Denna post skapades 2014-11-12.
CPL Pubid: 205658

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)

Ämnesområden

Elektroteknik och elektronik

Chalmers infrastruktur