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A new solder matrix nano polymer composite for thermal management applications

Carl Zandén (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Xin Luo (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; L. L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Composites Science and Technology (0266-3538). Vol. 94 (2014), p. 54-61.
[Artikel, refereegranskad vetenskaplig]

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupiing and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn-Ag-Cu matrix into a silver nanoparticle coated electro spun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn-Ag-Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications. (C) 2014 Elsevier Ltd. All rights reserved.

Nyckelord: Metal matrix composites (MMCs), Nano composites, Thermomechanical properties, Electrospinning, Liquid metal infiltration, LEAD-FREE SOLDERS, MECHANICAL-PROPERTIES, CONDUCTIVE ADHESIVES, INTERFACE MATERIALS, INTERMETALLIC COMPOUNDS, CARBON NANOTUBES, RELIABILITY, NANOFIBERS, POLYIMIDE, COPPER, LANNAY F, 1987, JOURNAL OF MATERIALS SCIENCE, V22, P1



Denna post skapades 2014-06-13.
CPL Pubid: 199173

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)

Ämnesområden

Kompositmaterial och -teknik

Chalmers infrastruktur

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