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A D-band packaged antenna on low temperature co-fired ceramics for wire-bond connection with an indium phosphide power meter

Bing Zhang (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Li Wei (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik) ; Herbert Zirath (Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik)
ISAP 2013 - Proceedings of the 2013 International Symposium on Antennas and Propagation p. 637-640. (2013)
[Konferensbidrag, refereegranskat]

A D-band packaged grid array antenna (GAA) on Ferro A6M low temperature co-fired ceramic (LTCC, εr = 5.74, tanδ = 0.0023 @ 145 GHz) is presented. It is designed for wire-bond connection with an indium phosphide (InP) power meter as a demonstration of a D-band packaged radio. Dimensions of the GAA (x, y, z) = (12, 12, 0.5) mm3. Simulated by Ansoft HFSS, the antenna's impedance bandwidth is 139 - 149.3 GHz, maximum gain of 20.9 dBi @ 147.8 GHz with 3-dB gain bandwidth 139.5 - 150.8 GHz, vertical beams of 10° beamwidth in the broadside are detected 139 - 151 GHz on both E- and H-planes. The 25 um diameter co-planar bonding wires that bridge the InP chip and LTCC antenna substrate over a 250 um separation are studied, showing acceptable insertion loss and limited bandwidth. © 2013 Antenna Society of the Chinese Institute of Electronics.



Denna post skapades 2014-03-14. Senast ändrad 2017-03-21.
CPL Pubid: 195078

 

Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Mikrovågselektronik

Ämnesområden

Telekommunikation

Chalmers infrastruktur