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Experimental Study on the Mechanical Reliability of Carbon Nanotubes

Yan Zhang ; Ling Wang ; Jingyu Fan ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT) p. 105-108. (2013)
[Konferensbidrag, refereegranskat]

Robust and reliable interconnect and effective heat management are two major concerns in the high-speed and high-power integrated circuit. Carbon nanotube (CNT) exhibits amazing mechanical, thermal and electronic properties due to the unique structure. Those superior features make CNTs preferable and promising for application in electronic components and devices. In the present paper, carbon nanotube bundles with an array pattern are fabricated, and then their mechanical strength and reliability are investigated experimentally. Different pressure loadings are applied on the surfaces of the CNT bundles and their deformation during loading process are observed. Furthermore, the responses of the CNT bundles under airflow impingement are studied. Various damage modes occur in the different loading conditions.

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Denna post skapades 2013-12-30. Senast ändrad 2015-02-20.
CPL Pubid: 190665


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Nanovetenskap och nanoteknik

Chalmers infrastruktur