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High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

Markus Dernevik (Institutionen för mikroelektronik)
Göteborg : Chalmers University of Technology, 1998. ISBN: 992-576032-1.
[Licentiatavhandling]

Nyckelord: electrically conductive adhesives, isotopic adhesives, anisotropic adhesives, flip-chip, interconnections, microwaves, surface mount technology, printed wire board, printed cirquit board, multilayer, sequential build-up board



Denna post skapades 2013-09-19.
CPL Pubid: 183688

 

Institutioner (Chalmers)

Institutionen för mikroelektronik (1995-2003)

Ämnesområden

Elektroteknik och elektronik

Chalmers infrastruktur

Ingår i serie

Technical report L - School of Electrical and Computer Engineering, Chalmers University of Technology. 276