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Metamatrial based packaging method for improved isolation of circuit elements in microwave modules

Ashraf Uz Zaman (Institutionen för signaler och system, Antenner) ; Mubarak Ellis (Institutionen för signaler och system, Antenner) ; Per-Simon Kildal (Institutionen för signaler och system, Antenner)
7th European Microwave Integrated Circuits Conference, EuMIC 2012 - Held as Part of 15th European Microwave Week, EuMW 2012; Amsterdam; Netherlands; 29 October 2012 through 30 October 2012 p. 834-837. (2012)
[Konferensbidrag, refereegranskat]

In this work, periodic structure has been used to design a new type of packaging technique to improve the isolation between microwave components within a module. In contrast to the conventional packaging technique, the new technique relaxes the requirement for using vias in the substrate and using conductive adhesive or gasket material within a typical multiple compartment microwave modules. On the other hand it uses a periodic structure of metal pins to form a lid for the microwave module. The achieved level of isolation in X-band and Ku-band for a two compartment test circuit is better than 65 dB which is better than the existing packaging technique within the band of interest.

Nyckelord: packaging method; mult-compartment microwave module; iolation; electromagnetic interference; periodic structure

Denna post skapades 2013-03-20. Senast ändrad 2015-07-03.
CPL Pubid: 174864


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Institutioner (Chalmers)

Institutionen för signaler och system, Antenner (2005-2014)


Elektroteknik och elektronik

Chalmers infrastruktur