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Thick film patterning by lift-off process using double-coated single photoresists

Yifeng Fu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; L. L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Materials Letters (0167-577X). Vol. 76 (2012), p. 117-119.
[Artikel, refereegranskad vetenskaplig]

A novel method using lift-off process for patterning very thick materials is developed and demonstrated. Unlike conventional lift-off processes, no special lift-off resist is used in this method. Instead, only a double-coated single photoresist is needed. Demonstrations using two commercial photoresists show that good patterning morphology and obvious undercuts as high as 15 mu m are obtained for lift-off, which is very difficult to achieve by existing methods. The application and feasibility of this approach is demonstrated by a carbon nanotube transfer process. This simple and effective method offers wider option to pattern very thick materials in high quality which are in strong demands.

Nyckelord: Thick film deposition, Lift-off, Double-coated photoresist, low-temperature, mems, transducer, deposition, scale

Denna post skapades 2012-06-07. Senast ändrad 2012-09-19.
CPL Pubid: 158627


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)



Chalmers infrastruktur