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Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Xia Zhang (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Teng Wang (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Pär Berggren ; Si Chen ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
ECS Transactions. China Semiconductor Technology International Conference 2010, CSTIC 2010, Shanghai, 18-19 March 2010 (1938-5862). Vol. 27 (2010), 1, p. 825-830.
[Konferensbidrag, refereegranskat]

Carbon Nanotube (CNT) has been proposed as a promising candidate material to build next generation flip chip interconnects in electronics. In this paper, flip chip assembly using CNT bumps and ACF is performed. To realize CNT-based interconnects, post-growth processes including deposition of metallic layers on CNT bundles and low temperature transfer of CNT bundles have been developed to overcome the problems of the high growth temperature of CNT as well as the poor adhesion between CNT bumps and substrates. Moreover, ACF has been used to assemble the CNT bumps on another Si substrate. The electrical test is performed also to verify the good contact between CNT bumps and ACF.



Denna post skapades 2012-04-16. Senast ändrad 2014-03-21.
CPL Pubid: 156725

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)

Ämnesområden

Elektroteknik och elektronik
Materialteknik

Chalmers infrastruktur