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Waveguide Packaging Technology for THz Components and Systems

Vincent Desmaris (Institutionen för rymd- och geovetenskap, Avancerad mottagarutveckling) ; Dimitar Dochev (Institutionen för rymd- och geovetenskap, Avancerad mottagarutveckling) ; Denis Meledin (Institutionen för rymd- och geovetenskap, Avancerad mottagarutveckling) ; Alexey Pavolotsky (Institutionen för rymd- och geovetenskap, Avancerad mottagarutveckling) ; Victor Belitsky (Institutionen för rymd- och geovetenskap, Avancerad mottagarutveckling)
Proceedings of 6th ESA Workshop on Millimetre-Wave Technology and Applications, May 23-25, 2011, Espoo, Finland (2011)
[Konferensbidrag, refereegranskat]

We present an integrated THz waveguide packaging solution based on the combination of all-metal micro-machined THz waveguide technology and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. This packaging solution is compatible with different THz component technologies, for room temperature and cryogenic operations and employs space-qualified wire-bonding for electrical contacting. The THz waveguide packaging provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while the alignment accuracy of the active component chip was measured to be about 2 μm. Some of the demonstrators are already in used, at.e.g., APEX telescope in the SHeFI receiver.



Denna post skapades 2012-01-10. Senast ändrad 2014-09-02.
CPL Pubid: 152222