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Development and characterisation of nanofiber films with high adhesion

Xin Tang ; Hui Wang Cui ; Xiu Zhen Lu ; Qiong Fan ; Zhichao Yuan ; Lilei Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Proceedings of the IEEE Electronics Components and Technology Conference (ECTC) 2011, May 31 – June 2011, Florida, US (0569-5503). p. 673 - 677. (2011)
[Konferensbidrag, refereegranskat]

With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronic packaging. This paper reports the study on fabrication of a nanofiber films used for nano-thermal interface material (nano-TIM) with the adhesive function. The nano-TIM with high thermal conductivity and low thermal resistivity has been fabricated by electrospinning process. In the present work, hotmelt was added into the electrospinning solution to improve the adhesion properties of the film. The morphology of the film was observed by Scanning Electrical Microscope (SEM). The nanofiber films have a nano-scale structure with hotmelt randomly attached into the fiber matrix. Shear tests were conducted to measure the bonding strength of nanofiber films. The results show that the nanofiber films reached a 6.52 MPa in terms of average shear strength, more than 2 times better than the case without the hotmelt addition.

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Denna post skapades 2012-01-04.
CPL Pubid: 151739


Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Nanovetenskap och nanoteknik
Elektroteknik och elektronik

Chalmers infrastruktur