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Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Författare och institution:
Y. Zhang (-); Zhili Hu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem); L. Ye (-); Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Publicerad i:
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, s. 506-509
ISBN:
978-145771768-0
Publikationstyp:
Konferensbidrag, refereegranskat
Publiceringsår:
2011
Språk:
engelska
Fulltextlänk:
Sammanfattning (abstract):
For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.
Ämne (baseras på Högskoleverkets indelning av forskningsämnen):
TEKNIK OCH TEKNOLOGIER ->
Elektroteknik och elektronik
Postens nummer:
150816
Ingår i post nr:
Posten skapad:
2011-12-22 11:01

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