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Molecular dynamics simulation for the bonding energy of metal-SWNT interface

Y. Zhang ; Zhili Hu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; L. Ye ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011 p. 506-509. (2011)
[Konferensbidrag, refereegranskat]

For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.



Denna post skapades 2011-12-22.
CPL Pubid: 150816

 

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