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Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Xingrui Chen (Institutionen för mikroteknologi och nanovetenskap) ; Teng Wang (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Joachim Nurnus ; Mike Benkendorf ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 Article number 5582779, p. 1250-1254 . (2010)
[Konferensbidrag, refereegranskat]

Miniaturized thermoelectric coolers is one of the most promising active heat dissipating methods in hot spot cooling, laser cooling and other applications. Improving mechanical strength can potentially boost the reliability of this technology. In this paper, simulations and mechanical compression experiments were carried out on miniaturized thermoelectric coolers both with and without underfiller. The results of the simulations and experiments indicate that the underfill process technology is highly effective means to improve the mechanical strength of miniaturized thermoelectric coolers.

Denna post skapades 2010-12-09. Senast ändrad 2016-10-26.
CPL Pubid: 130488


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap
Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)



Chalmers infrastruktur