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Wafer bonding: A retrospective

Stefan Bengtsson (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem)
ECS Transactions. Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele (1938-5862). Vol. 33 (2010), 4, p. 429-439.
[Konferensbidrag, refereegranskat]

Wafer bonding has become well-known and widely used as the process of adhesion of two flat mirror-polished wafers without the use of any intermediate adhesive layer. Today, it is used as a versatile tool in a wide variety of scientific fields and the technique has reach industrial maturity in particular for the manufacturing of Silicon-On-Insulator (SOI) materials, but also in other fields, such as for sensors, microsystems, optics and photonics. The early development of wafer bonding is reviewed and a retrospective view is taken on wafer bonding, addressing some of the critical research achievements and breakthroughs over the last three decades. The focus is limited to wafer bonding without the use of adhesive layers or electrostatic fields, and will hence not discuss related techniques, such as anodic bonding.

Denna post skapades 2010-11-10. Senast ändrad 2016-10-26.
CPL Pubid: 128847


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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Elektroteknik och elektronik

Chalmers infrastruktur