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Characterization of thermally conductive epoxy nano-composites

Lisa Ekstrand (Institutionen för mikroteknologi och nanovetenskap, Fasta tillståndets elektronik) ; Helge Kristiansen ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Fasta tillståndets elektronik)
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005 p. 35-39. (2005)
[Konferensbidrag, refereegranskat]

This work aims to develop an Anisotropic Conductive Adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment. The thermal measurements are carried out by transient hot wire method. So far, the thermal conductivity of the epoxy has been increased with more than 100%.



Denna post skapades 2007-01-15. Senast ändrad 2016-05-19.
CPL Pubid: 11691

 

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Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Fasta tillståndets elektronik (2003-2006)

Ämnesområden

Elektroteknik och elektronik

Chalmers infrastruktur