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Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails

Eva Rajo-Iglesias (Institutionen för signaler och system, Antenner) ; Ashraf Uz Zaman (Institutionen för signaler och system, Antenner) ; Per-Simon Kildal (Institutionen för signaler och system, Antenner)
IEEE Microwave and Wireless Components Letters (1531-1309). Vol. 20 (2009), 1, p. 31-33.
[Artikel, refereegranskad vetenskaplig]

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.

Nyckelord: Gap waveguide; Microstrip circuit; Mode suppression; Packaging

Denna post skapades 2010-01-11. Senast ändrad 2016-07-25.
CPL Pubid: 106380


Institutioner (Chalmers)

Institutionen för signaler och system, Antenner (2005-2014)



Chalmers infrastruktur