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FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

Nabi Nabiollahi ; Johan Liu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Zhili Hu (Institutionen för mikroteknologi och nanovetenskap, Bionanosystem) ; Yan Zhang ; Cong Yue ; Zhaonian Cheng ; Masahiro Inoue
2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009 p. 422-425. (2009)
[Konferensbidrag, refereegranskat]

A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.

Denna post skapades 2009-12-15. Senast ändrad 2017-11-16.
CPL Pubid: 103657


Institutioner (Chalmers)

Institutionen för mikroteknologi och nanovetenskap, Bionanosystem (2007-2015)


Teknisk mekanik

Chalmers infrastruktur